RO4003C 2-Layer ENIG PCB – High-Frequency RF Board for 5G & Automotive Radar
1.Introduction to RO4003C Material
Rogers RO4003C is a high-performance woven glass-reinforced hydrocarbon/ceramic laminate that combines the electrical properties of PTFE with the cost-effective manufacturability of epoxy/glass. Designed for RF and microwave applications, it offers tight dielectric constant (Dk) control, low loss, and thermal stability without requiring specialized processing like PTFE-based materials.
Key advantages of RO4003C include:
CTE matched to copper for dimensional stability in multi-layer PCBs.
High Tg (>280°C) for reliability in extreme thermal conditions.
Low moisture absorption (0.06%) and consistent performance across frequencies.
2.Key Features of RO4003C PCB
Dielectric Constant (Dk): 3.38 ±0.05 @ 10GHz
Dissipation Factor: 0.0027 @ 10GHz (ultra-low loss)
Thermal Conductivity: 0.71 W/m/°K
CTE: X/Y/Z = 11/14/46 ppm/°C (prevents via cracking)
Surface Finish: Electroless Nickel Immersion Gold (ENIG) for corrosion resistance.
3.PCB Construction Details
| Specification | Value |
|---|---|
| Base Material | RO4003C |
| Layer Count | Double sided |
| Board Dimensions | 580mm x 410mm (1 PCS) +/- 0.15mm |
| Minimum Trace/Space | 6/10 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 1.6mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% Electrical test prior to shipment |
4.PCB Stackup: 2-layer rigid PCB
Copper layer 1 - 35 μm
Rogers 4003C Core - 1.524 mm (60mil)
Copper layer 2 - 35 μm
5.Board Statistics
Components: 92
Total Pads: 227
Thru Hole Pads: 171
Top SMT Pads: 56
Bottom SMT Pads: 0
Vias: 48
Nets: 2
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Benefits
Ideal for multi-layer board (MLB) constructions
Processes like FR-4 at lower fabrication cost
Designed for performance sensitive, high volume applications
Competitively priced
8.Target Applications
5G & Cellular Base Stations (antennas, power amplifiers).
Automotive Radar/Sensors (ADAS, mmWave).
Satellite Communication (LNBs, RF tags).